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Shenzhen Jingxin Electronic Technology Co., Ltd.

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PCB Design Service
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Product: Views:226PCB Design Service 
Unit price: Negotiable
Delivery date: Since the payment date Days delivery
Valid until: Long-term effective
Last updated: 2019-09-14 11:37

PCB Design Service

1. We offer One-shop PCAB/PCB manufacturing service

2.10 year of pcb design service and turnkey ODM/OEM experience

3. We can provide F4B,F4BK, Teconic,Arlon,Rogers materia PCB

4. Timely customizations PCBs and PCBAs

Detailed Terms

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technolog

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity

PCBA Technical Capacity


Position accuracy: 20 um

Components size: 0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP

Max. component height: 25mm

Max. PCB size: 680×500mm

Min. PCB size: no limited

PCB thickness: 0.3 to 6mm

PCB weight: 3KG


Max. PCB width: 450mm

Min. PCB width: no limited

Component height: Top 120mm/Bot 15mm


Metal type: part, whole, inlay, sidestep

Metal material: Copper, Aluminum

Surface Finish: plating Au, plating sliver , plating Sn

Air bladder rate: less than20%


ICT, Probe flying, burn-in, function test, temperature cycling, AXI – 2D and 3D automated X-ray inspection, AOI – automated optical inspection

PCB Assembly Process

Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

Testing Services

X-Ray (2-D and 3-D)

BGA X-Ray Inspection

AOI Testing (Automated Optical Inspection)

ICT Testing (In-Circuit Testing)

Functional Testing (at the board & system level)

Flying Probe 


Surface Mount Technology/ Parts (SMT Assembly)

Through-Hole Device/ Parts (THD)

Mixed Parts: SMT & THD assembly

BGA/ Micro BGA/ uBGA

QFN, POP & lead-less chips

2800 pin-count BGA

0201/ 1005 passive components

0.3/ 0.4 Pitch

PoP Package

Flip-chip under-filled CCGA

BGA Interposer/ Stack-up